Union Minister of State for Electronics and IT, Rajeev Chandrasekhar, announced on Thursday that Assam will soon see its first semiconductor packaging plant, valued at nearly Rs 25,000 crore, established through a partnership between the state government and the Tata Group, the media has report.
Speaking at the inaugural “Digital India Future Skills Summit” in Guwahati, the minister highlighted that this development will provide job opportunities in the semiconductor industry for the youth of Assam within their vicinity, says a report by news agency IANS.
“It is because of the leadership of Chief Minister Himanta Biswa Sarma that a semiconductor packaging plant will be established in partnership with the Assam government and Tata Group,” the MoS IT was quoted as saying by IANS.
“We will soon obtain all approvals and submit it to the cabinet for final approval. Young Indians aspiring to enter the world of semiconductors won’t have to leave their state or travel to other cities anymore,” he added.
The MoS IT underscored India’s remarkable economic advancement over the past decade, transitioning from being part of the “Fragile 5” to now being recognised as one of the world’s “Top 5” economies. It is pertinent that Guwahati hosts some of the world’s largest companies in these sectors, such as Nvidia, Intel, AMD, HCL, Wipro, and IBM.
Prime Minister Modi has established a three-part strategy to influence the future of technology: ‘futureDESIGN’ focuses on design innovation, ‘futureLABS’ centers on innovation in systems, and ‘futureSKILLS’ aims to equip young Indians with capabilities in emerging sectors.
The summit facilitated over 30 strategic collaborations between the National Institute of Electronics and Information Technology (NIELIT) and prominent industry players and academic institutions, including Intel, HCL, Wipro, Microsoft, Kyndryl, IIM Raipur, and IIITM Gwalior, among others.